Nanoscale Semiconductor

Symposium Scope & Objectives

The Nanoscale Semiconductor Symposium at ICONN 2026 will explore the latest breakthroughs in semiconductor technology, with a particular focus on nanoscale integration, advanced packaging, and the challenges of interfacing diverse electronic, photonics, and quantum systems. This symposium aims to provide a comprehensive forum for discussing not only novel materials and device architectures, but also the critical issues surrounding the next-generation semiconductor technologies.
The symposium will delve into the interfacing challenges that arise when merging diverse components, from rigid CMOS-based systems to emerging flexible and wafer-level 3D integration solutions. Discussions will span topics and applications from advanced lithography and deposition techniques, featuring insights from world leaders in 3DIC initiatives and experts from international semiconductor foundries.
In addition, the symposium will aim to address the policy and strategic dimensions of semiconductor development. Sessions will aim to cover critical regulatory and investment frameworks, including the USA Chips Act, European investment initiatives, and the AUKUS perspectives, that are shaping the global semiconductor landscape. Diverse academics and industry leaders will share their views on how these policies influence research, development, and manufacturing on a global scale.
We invite you to submit your abstracts and join us in this exciting exploration of nanoscale semiconductor technology. Your contributions will help shape the future of the industry and foster a dynamic dialogue among researchers, policymakers, and industry experts.

Key Topics include

Nanomechanics of Advanced Materials 

• Nanoscale Integration Techniques:
  Advances in integrating nanoscale devices and components, including heterogeneous materials and emerging 3D integration methods.

• Advanced Packaging and Interconnection:
  Innovations in packaging strategies, wafer-level integration, thermal management, and reliability challenges in next-generation devices.

• Interfacing Diverse Systems:
  Challenges and solutions for merging traditional CMOS, flexible electronics, MEMS, photonics, and quantum systems.

• Advanced Lithography and Deposition Processes:
  New techniques in patterning and material deposition critical for fabricating nanoscale semiconductor structures.

• Novel Materials and Device Architectures:
  Discussion of emerging semiconductor materials, including quantum materials, and innovative device designs. 

• Application-Driven Innovations:
  Case studies and breakthroughs in sectors such as neuromorphic computing, healthcare, automotive, IoT, and environmental monitoring driven by nanoscale semiconductor advances.

• Future Trends in Manufacturing:
  Overcoming scalability challenges, evolving fabrication methods, and strategies to meet the demands of next-generation semiconductor technologies.

• Policy and Strategic Directions in Semiconductor Development
  Impact of global policies, investments, and regulations on semiconductor research, manufacturing, and supply chains.

Target Audience

This symposium will appeal to researchers, engineers, and industry professionals working on nanoscale semiconductors, advanced materials, photonics, and quantum systems. It brings together academic innovators pushing the boundaries of nanoscale integration with engineers and industry experts designing, manufacturing, and packaging the next generation of semiconductor devices. Leaders in R&D, technology strategy, and policy will share insights on turning breakthrough research into practical solutions, while investors and global stakeholders explore the frameworks shaping our industry. Join us for a dynamic forum where ideas converge, collaborations ignite, and the future of nanoscale semiconductors is collectively envisioned.